
Recently, Capcon’s large panel-level packaging die bonder,AvantGo L6 (Leo), has been adopted in bulk by an Internationally Leading IDM manufacturer and mass producer. It is believed that with the bulk application of AvantGo L6 by client, it will lead the panel-level packaging equipment towards maturity, laying a solid foundation for the development of the panel-level packaging industry and opening a new chapter of advanced packaging with low cost and high efficiency.